TIP R-5010 Replacement of the Existing PSA Hotmelt Glue Module
Machine Model for ImprovementAll BW Bielomatik RFID converting machines from T165/21 onwards.
Description of Improvement
module with an advanced system.
The delivery scope is a module plate, a hotmelt tank for one nozzle, one specialized glue nozzle and specialized fixing parts. A special software application will provide an optimized coatweight control. Significantly better gluing uniformity compared with the existing system will be achieved, even during acceleration and deceleration.
This is achieved by a different controls architecture, including an additional high-precision glue pump close to the tip of the nozzle.
- High-precision glue application due to a special application pump in the gluing head
- Optimized gluing characteristics during acceleration and deceleration
- Extension to PUR / POR gluing possible
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